I've done whatever I want

Chapter 133 Thinning thickness 150um
"Let's go to the workshop and have a look!" With a new project in mind, Xin Tong didn't dare to be careless at all.

Peter, the engineering director, talked about some big principles in the conference room, and Xin Tong felt that the details of the project were the key to success.

details make a difference!

"Okay!" Jiang Hua also put out the cigarette, threw it into the ashtray, and shook his lush hair.

After returning from the smoking area, the two went straight to the wafer thinning operation area of ​​the FOL production workshop, which is the first process of the entire packaging and testing factory.

The wafers produced from the fab factory are full of silver light, which looks like a round mirror, which can illuminate the appearance of people.

Generally speaking, it is not good for the wafer to be too thick, which is not conducive to the heat dissipation of the chip, and the reliability of the product is usually directly related to the thermal stress. The thinned wafer can improve the reliability of the chip.

Because of this, engineers and technicians have been pursuing the ultimate thinness of some power device chips that are prone to heat generation.

However, the thickness of the wafers received by the packaging and testing factory will exceed the standard. If the thickness is too thin, it will be broken if it is shaken casually, which is not conducive to transportation safety. Therefore, thinning is the first production process of the packaging and testing factory.

Xin Tong walked in and found that it was an independent clean room, quiet, like a paradise.

The area of ​​the thinning clean room seems to be almost one-twentieth that of the bonding workshop. The entire wafer thinning and grinding process is carried out in pure water and does not produce audible noise.

Compared with those ASM bonding machines in the bonding workshop, the size of the Japanese DISCO thinning machine is several times larger, and it looks more majestic.

There is a row of nitrogen cabinets next to the tall thinning machine. The nitrogen cabinets have temperature and humidity monitoring devices and nitrogen flow monitoring devices. Under the maintenance of high-purity nitrogen, the unsealed and thinned wafers stored in them be intact.

But it's also a big expense.

Generally speaking, the wafers produced from the Fab factory are vacuum-packed to prevent the pads from being oxidized by moisture. From experience, the Floor Life of the wafer is one week. If it exceeds one week, the pads are at risk of oxidation. , the bonding quality will be greatly compromised, and storage in a nitrogen cabinet can extend the use time of the wafer.

Although he has worked in the engineering department of FOL for more than a year, Xin Tong seldom comes to this clean room. Now that he has been promoted to be a project manager, he has the opportunity to touch all the production processes of the whole factory.

It was also something he dreamed of.

However, Jiang Hua often comes here. Since being promoted to FOL production supervisor, his territory has expanded a lot. From wafer thinning to bonding, these processes have been placed under his jurisdiction.

The engineering technology for this process is handled by Xie Jianfeng, the Growth King of the Four FOL Kings.

"Manager Xin!" Xie Jianfeng nodded towards Xin Tong.

He was doing visual management work in the thinning process, when he saw Xin Tong walking in, he took the initiative to come over and say hello.

"Thank you, what is the technological capacity of our equipment?" Xin Tong asked straight to the point.

Only by understanding the capabilities of process equipment can we know ourselves and the enemy, and be victorious in all battles.

"Manager Xin, the thickness of an 8-inch wafer is 725um. At present, the thickness of our Disco thinner can reach 180um after thinning." Xie Jianfeng knows the equipment process capability like the back of his hand.

180um?Xin Tong has seen the process requirements of MPC5200, and the customer's thinning thickness requirement is 150um.

"The specifications of the Motorola project are 150um! The wafers specified by the customer will arrive next week. We must discuss a feasible plan today!" Xin Tong said with a troubled face.

Fortunately, I got out of the workshop and walked around. If I didn't understand the actual process capability of the equipment and rushed into battle, this project would definitely die miserably!

"Thank you, if the Disco equipment can't do it, this project may be ruined!" Jiang Hua was worried.

The success or failure of a new project mainly depends on the craftsmanship!
"Director Jiang, don't be so pessimistic. Our engineering department will find ways to improve the capacity of the thinning equipment!" Xie Jianfeng said while patting Jiang Hua on the shoulder.

180um is the technical requirement of old products, and the equipment has never produced 150um wafers. It is not known until the donkey or the horse has to be pulled out.

"Thank you, which ones are the thinning machines with the most stable performance?" Xin Tong asked.

Only when the sharp sword is sold can the demon be killed.If you want to make it thin, you can only rely on the best machine in the factory!

"No. 3 thinning machine!" Xie Jianfeng thought for a while, then pointed to a piece of equipment beside him and replied.

"Okay, the wafers for this project will be produced on the No. 3 machine from now on!" Xin Tong patted the No. 3 thinning machine with his hands, his eyes were full of affection.

"Don't worry!" Jiang Hua said.

"Thank you!" Xin Tong said.

Although a special machine was designated for production, Xin Tong felt that process verification should be done sooner rather than later.

"Thank you, today you get some fake chips from the warehouse and do DOE verification first! Let's see if we can achieve 150um. After all, the customer's wafers are limited. We directly use the customer's wafers for DOE verification, in case the verification fails. What should I do? Let the customer send the wafers again? This will delay our entire project cycle by at least half a month." Xin Tong's face was full of clouds.

By locking in machines with stable performance and arranging fake film verification in advance, Xin Tong felt that this could reduce the risk of the project.

Obviously, Peter, who has never been to the grassroots, has no idea about this.

"Manager Xin, yes!" Xie Jianfeng nodded.

After arranging the work, Xin Tong felt much more relaxed.

"Thank you, Director Jiang, let's go and see the wafer cutting process together!" Xin Tong said.

"Okay!" Xie Jianfeng nodded.

The three of them left the thinning clean room and walked towards the wafer cutting area.

　Looking at it today, 150um is nothing.

　　
　
(End of this chapter)