I've done whatever I want

Chapter 134 The Lifetime of Knives
If the FOL workshop is compared to a luxurious seven-star hotel, there are many bonding process machines, which are arranged in the lobby. The wafer cutting process is the same as the thinning process, with a small number of machines, and they are all arranged in independent small rooms. inside.

These two processes are connected through a small door and share deionized DI pure water.

DI pure water has three functions: one is to clean silicon chips generated during the cutting process, one is to cool down the heat generated during the cutting process, and the other is to protect the wafer from ESD static electricity.

The purpose of this process is to divide the circular mirror-like wafer into Dies with independent electrical properties. Each Die will become an independent chip after packaging.

Today, with the ultimate pursuit of thin wafers by engineering and technical personnel, the thickness of wafers after thinning is also constantly setting new records, from 100 μm to 50 μm, and then to 30 μm.

In order to meet the needs of cutting thin slices, with the development of science and technology, the cutting methods for obtaining independent chips are constantly changing and developing from splitting, blade cutting, to laser cutting, and then to plasma cutting.

In 2003, blade cutting was the mainstream cutting method, and this cutting method is still widely used by many packaging and testing factories today.

In the wafer cutting clean room, looking from a distance, the wafers are shining silver under the light of fluorescent lamps.

Looking closer, it is surprising that there are dense grains growing on those round mirrors, and the spacing between the grains is like a street. That is the dicing groove. The English name is Dicing Street, which is very vivid. .

Operators wearing white electrostatic suits are busy loading and unloading materials, engineers and technicians wearing blue electrostatic suits are busy modifying machine operations, and inspectors wearing red one-piece electrostatic suits are measuring the width of the cutting lane after cutting in order to control the product. quality.

The wafer cutting process looks busy.

Xin Tong walked to a wafer cutting machine and stared at the cutting table quietly. There were no sparks or harsh noises. The diamond cutting knife lightly scratched the wafer, like a boat sailing on water, Single Pass, The dragon-slaying sword's ability to cut iron like mud was brought into full play, and the grains were quickly divided.

Immediately before Xin Tong's eyes flashed several swordsmen with great ambitions in Jin Yong's works. They have been wandering all over the world in search of a rare sword all their lives.

How pleasant it is to hold a sword to the end of the world, flick the sword and sing!
Obviously, the success or failure of this process is related to the sword, just like the martial arts of the swordsman is related to the precious sword, and the master in online games is related to the equipment.

The most direct result of how to use tools is that humans walked out of the virgin forest. To this day, the rational use of tools is one of the main magic weapons for people to defeat the enemy.

The texture of the cutting knife essentially determines its cutting quality. The cutting speed and feed speed can maximize the texture of the knife, and truly achieve the state of cutting iron like mud!

However, no matter how sharp the knife is, it will dull at that moment. The life control of the tool is especially important in this process.

"How to ensure the quality of these knives?" Xin Tong turned his head and asked.

"Manager Xin, have you seen the inspectors? They will randomly check the width of the cutting line and the appearance of the product. If there is any abnormal chipping of the tool, we can know it through product inspection." Jiang Hua replied.

In public, he calls Xin Tong the manager, but in private, he likes to call him an old classmate.

Xin Tong's face was clouded immediately. Obviously, this kind of answer could not satisfy him. He waited until the product was abnormal before thinking about changing the knives. A lot of defective products were produced, and the day lily was cold!
"Manager Xin, we will control the life of the knives!" Xie Jianfeng said while opening the control interface of the equipment.

"Look, the Lifetime of the tool is here, and a record will be left for every cut! When the life of the tool exceeds the standard, the device will automatically alarm and remind!" Xie Gong pointed to the control interface and said.

"Thank you!" Xin Tong nodded.

It is good to use the alarm reminder function. This method of prevention from the source is the correct way of control!

He raised his head and looked at the audible and visual alarm, and was filled with emotion.

This is a smart workshop, and this is a practice that does not require human judgment.

"What is the width of the cutting lane?" To the naked eye, the cut wafer was still intact. Xin Tong couldn't help but asked curiously as he stared at the cutting wafer.

"Manager Xin, the minimum cutting line width that this knife can achieve is 25 microns." Worker Xie pointed to the cutting knife and said.

25 microns, too sharp!This is a thickness that Mo Xie, a famous swordsmith of a generation, cannot imagine. No wonder it cuts without leaving a trace!

Xin Tong stared at the cutting table quietly, and soon a layer of blue film aroused his interest. He had also seen this layer of blue film during the thinning process, but in the cutting process, the blue film was fixed on a metal steel ring. superior.

"It's very interesting. The blue film under the wafer is put on the steel ring!" Xin Tong said, which reminded him of Nezha's collar.

"This layer of tape is to protect the wafer from external damage during the cutting process. The separated grains will stick to the blue film. If there is no blue film, all the separated grains will fall off. Steel ring It is used to fix the blue film." Xie Gong explained.

"Oh!" Xin Tong nodded.

He watched the wafer cutting quietly, except for Jin Yong's martial arts novels, he had never seen or heard of such a fast and sharp knife!

This is an amazing knife!

Eye-opening!
After thinking calmly, he was still full of doubts about the one-size-fits-all approach. He was worried that the cutting stress would cause the wafer to chip: "Xie Gong, the thickness of the wafer after we thinned it is still 150 microns. Is it reasonable to use one-size-fits-all cutting?"

"Manager Xin, practical experience tells us that one-size-fits-all is not a big problem. Of course, there is now a two-cut process called Step Cut, which uses two blades to complete the cutting of the wafer. This two-cut process can effectively improve The problem of chip edge collapse," Xie Gong said.

"Thank you, our Motorola project needs to use step cutting. The risk of one-size-fits-all is too great!" Xin Tong said.

Although he has no practical experience, he was a master of science in his previous life. From the force analysis, he felt that the stress exerted on the wafer by double cutting would be much less, and the quality after cutting must be better.

"Okay, I will arrange a fake film to try this craft today!" Xie Gong nodded.

"You can give it a try first. What I want is a process that has been analyzed by DOE to ensure it is foolproof!" Xin Tong said with a smile.

Jiang Hua stood aside, watching him pointing to Xie Jianfeng, one of the Four Heavenly Kings, he was so surprised that he couldn't say a word!
This Xin Tong is no longer the scumbag he was back then!
　Sincerely thank you all for your support!I wish everyone a happy Mid-Autumn Festival in advance!

　　
　
(End of this chapter)