I've done whatever I want
Chapter 135 Re-Chapter Plastic Sealing Process
Chapter 135 Returning to the Plastic Sealing Process
The king status of the bonding process is unshakable!
For the engineering and technical personnel of the integrated circuit packaging and testing factory, if they have deeply mastered the bonding process, and then look at other processes, they will feel a bit low from a high position. This is why the technology of the packaging and testing factory Most of the people in charge come from this process.
The technicians in the packaging and testing factory are also proud to have done the bonding process.
After leaving the independent clean room for wafer dicing, Xin Tong felt that although this process is also the core process of the packaging and testing factory, there are not many difficulties except that the validity period of the silver glue is a little challenging. .
This MPC5200 is packaged using BGA technology. Compared with TSOP packaging, it has a smaller size, better heat dissipation performance and electrical performance.
When walking through the bonding workshop, Xin Tong did not stop.
This king process is his specialty. Although MPC5200 has 272 pins, it means that 272 gold wires need to be bonded. The duration is related to these parameters. At the same time, the shape of the arc, such as arc height and arc length, may affect the product quality of the plastic sealing process. However, Xin Tong has experienced too much wind and rain, and he has a plan for all this.
The only variable is the process engineer Su Tianyi, but Xin Tong understands everything Su Gong knows. Xin Tong does not expect Su Gong to exert much energy on this project.
He can't become a bug, and he can't cause any waves.
After going through all the processes in the FOL workshop, Xin Tong already has a bottom line in his mind.
This MPC5200 must be converted to production perfectly!
Compared with the various processes of FOL, EOL has only one process of plastic sealing, which is a bit challenging. Xin Tong went to the office of the production department and went straight to the manager Han Leng: "Old Han, the Motorola project, I am most worried about molding now. !"
"Let's go to Molding together!" Han Leng said while standing up.
Lin Daiyu turned around and glanced at Xin Tong. It was unbelievable that the handsome guy in front of her rose quite quickly in the Mingyueguang Packaging and Testing Factory, and even climbed to the position of manager.
If there is no Lao Han, he might be cleaning the mold in the plastic sealing process.
After a while, the two came to the plastic sealing process.
Noisy, hot, and it looks the same as it did last year.
Thinking back to when he first joined the company last year, Xin Tong remembered that he was assigned to the Molding process.
At that time, disappointment was written on the face, and the ideal was shattered.
The former roommate, the fat Zhu Tianli, worked hard here, but now he has followed Xiang Gong to Suzhou.
A year has passed, and Xin Tong is full of emotions when he returns to the plastic sealing process.
"Manager Xin, this is manual molding, and the BGA packaged products are auto molding, in another workshop!" Han Leng said.
"Oh!" Xin Tong was thoughtful.
It would be hard for Allan to accept plastic sealing in this noisy workshop!
Auto Molding is located in a separate clean room.
Xin Tong walked in and saw that the fully automatic plastic sealing equipment here was sealed and looked like a giant.
The operation of the manual mold includes the loading and unloading of the frame and the plastic sealing material preheating operation. The operator needs to be on the high-temperature preheating table and the plastic sealing mold to frequently load and unload materials, which is very difficult.
However, the entire preheating and heating device of the fully automatic equipment is sealed, and it can be molded at one time. Compared with all the strong men in the manual mold workshop, this workshop is much more harmonious.
If he had been assigned to the Auto Molding workshop, he would not have been so disappointed.
"Is the temperature of these molds monitored?" Xin Tong turned around and asked.
As an engineering technician, he pays great attention to the monitoring of process parameters.
"Yes, look at all mold temperatures. They have set values and monitoring values. Once an abnormality occurs, the equipment will automatically alarm!" The process engineer explained while bringing up the monitoring interface on the display screen.
"Oh!" Xin Tong looked at the sound and light alarm system attached to the device.
With the Sensor induction and alarm system, it is difficult for the operator to make mistakes!
Looking at 4M1E, in addition to process, Xin Tong began to pay attention to the impact of material factors.
The core material of this process is epoxy molding compound, the English name is EMC (Epoxy Molding Compound). It is made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon powder and other fillers, and a variety of Mixed with additives.
The plastic sealing process uses transfer molding to squeeze EMC into the mold cavity of the plastic sealing machine, embed the semiconductor chip in it, and simultaneously cross-link and solidify it to form a semiconductor device with a certain structural appearance.
The purpose of plastic packaging is to protect the chip from the external environment; resist external moisture, solvents, and impact; make the chip electrically insulated from the external environment; good installation performance; resist thermal shock and mechanical vibration during installation; thermal diffusion, etc. .
"How is the validity period of the plastic packaging compound controlled?" Xin Tong couldn't help asking when he saw that the homework instruction stated that the material should be awake for 24 hours and the use time after waking up is 48 hours.
"Manager Xin, we all control through the MES system! Once the plastic sealing material expires, the equipment will automatically alarm!" the process engineer said while calling up the MES system material information on the display.
"Oh!" Xin Tong nodded, and he looked up again at the sound and light alarm system attached to the device.
With such smart equipment, making products through this process is reassuring.
However, previous experience told him that there may be problems with wire punching after molding. The gold wire is too thin and too long, the injection molding process is improperly controlled, and the flow rate of molten EMC is too fast, which may impact the gold wire.
MPC5200 has 272 gold wires. Once punched, any two gold wires touch together, there is a risk of short circuit.
Obviously this is a challenge!
"How do you control the thread punching problem?" Xin Tong turned around and asked.
"Manager Xin, we need to work hard with the bonding engineers to solve this problem! The wire diameter, length and arc of the bonding wire will all affect the punching wire! Of course, the molding process parameters and EMC fluidity are also crucial!" Process Engineer explained.
"Okay, I will arrange the bonding process to make some dummies for you to debug the plastic sealing process!" Xin Tong said.
"Okay!" The process engineer nodded.
"How do you check the punching wire?" Xin Tong didn't know much about the EOL process. He had only heard about back-end molding people complaining about abnormal bonding after molding, and knew that they used an X-Ray machine.
In Mingyueguang packaging and testing factory, the front and back processes have access control, and his work card cannot open the back door. He just heard about the back process and equipment.
"Manager Xin, let's go and have a look!" Manager Han Leng said.
The inspection of punching is carried out in the X-Ray room. Because of the low radiation, this inspection process is arranged in an independent room.
Walking into the X-Ray room, it was very quiet inside, and I saw inspectors wearing red electrostatic suits performing X-Ray inspections, and gold wires were clearly visible on the color display.
"Manager Xin, this equipment is worth more than 2000 million!" Han Leng pointed at the X-Ray machine and said.
"2000 million?" Xin Tong was stunned. The semiconductor industry is really a money-burning industry.
"This equipment has a high-definition flat-panel detector with a resolution of 300W and high magnification. The structural image of the component under test is very clear, and it is easy to check the BGA bonding and welding problems after plastic packaging." Manager Han Leng said.
"Not bad!" Only with good equipment can we leave a good impression on customers. After all, customers will come to audit the factory before mass production.
After coming out of the plastic sealing process and returning to the production department, Lin Daiyu, a clerk of the production department, is distributing Guanshengyuan mooncakes to everyone.
It turns out that today is September [-]th, and tomorrow is the Lunar Mid-Autumn Festival!Xin Tong suddenly thought of his hometown in Yuezhou, his parents who lived in a dilapidated mud house, and how his mother was sitting at the entrance of the village crying when he followed Jiang Hua out to work.
When will the bright moon come? Ask the sky for wine!It’s the Mid-Autumn Festival again, and the story happens to be written during the Mid-Autumn Festival. What a coincidence.I sincerely wish everyone a happy Mid-Autumn Festival!
(End of this chapter)
The king status of the bonding process is unshakable!
For the engineering and technical personnel of the integrated circuit packaging and testing factory, if they have deeply mastered the bonding process, and then look at other processes, they will feel a bit low from a high position. This is why the technology of the packaging and testing factory Most of the people in charge come from this process.
The technicians in the packaging and testing factory are also proud to have done the bonding process.
After leaving the independent clean room for wafer dicing, Xin Tong felt that although this process is also the core process of the packaging and testing factory, there are not many difficulties except that the validity period of the silver glue is a little challenging. .
This MPC5200 is packaged using BGA technology. Compared with TSOP packaging, it has a smaller size, better heat dissipation performance and electrical performance.
When walking through the bonding workshop, Xin Tong did not stop.
This king process is his specialty. Although MPC5200 has 272 pins, it means that 272 gold wires need to be bonded. The duration is related to these parameters. At the same time, the shape of the arc, such as arc height and arc length, may affect the product quality of the plastic sealing process. However, Xin Tong has experienced too much wind and rain, and he has a plan for all this.
The only variable is the process engineer Su Tianyi, but Xin Tong understands everything Su Gong knows. Xin Tong does not expect Su Gong to exert much energy on this project.
He can't become a bug, and he can't cause any waves.
After going through all the processes in the FOL workshop, Xin Tong already has a bottom line in his mind.
This MPC5200 must be converted to production perfectly!
Compared with the various processes of FOL, EOL has only one process of plastic sealing, which is a bit challenging. Xin Tong went to the office of the production department and went straight to the manager Han Leng: "Old Han, the Motorola project, I am most worried about molding now. !"
"Let's go to Molding together!" Han Leng said while standing up.
Lin Daiyu turned around and glanced at Xin Tong. It was unbelievable that the handsome guy in front of her rose quite quickly in the Mingyueguang Packaging and Testing Factory, and even climbed to the position of manager.
If there is no Lao Han, he might be cleaning the mold in the plastic sealing process.
After a while, the two came to the plastic sealing process.
Noisy, hot, and it looks the same as it did last year.
Thinking back to when he first joined the company last year, Xin Tong remembered that he was assigned to the Molding process.
At that time, disappointment was written on the face, and the ideal was shattered.
The former roommate, the fat Zhu Tianli, worked hard here, but now he has followed Xiang Gong to Suzhou.
A year has passed, and Xin Tong is full of emotions when he returns to the plastic sealing process.
"Manager Xin, this is manual molding, and the BGA packaged products are auto molding, in another workshop!" Han Leng said.
"Oh!" Xin Tong was thoughtful.
It would be hard for Allan to accept plastic sealing in this noisy workshop!
Auto Molding is located in a separate clean room.
Xin Tong walked in and saw that the fully automatic plastic sealing equipment here was sealed and looked like a giant.
The operation of the manual mold includes the loading and unloading of the frame and the plastic sealing material preheating operation. The operator needs to be on the high-temperature preheating table and the plastic sealing mold to frequently load and unload materials, which is very difficult.
However, the entire preheating and heating device of the fully automatic equipment is sealed, and it can be molded at one time. Compared with all the strong men in the manual mold workshop, this workshop is much more harmonious.
If he had been assigned to the Auto Molding workshop, he would not have been so disappointed.
"Is the temperature of these molds monitored?" Xin Tong turned around and asked.
As an engineering technician, he pays great attention to the monitoring of process parameters.
"Yes, look at all mold temperatures. They have set values and monitoring values. Once an abnormality occurs, the equipment will automatically alarm!" The process engineer explained while bringing up the monitoring interface on the display screen.
"Oh!" Xin Tong looked at the sound and light alarm system attached to the device.
With the Sensor induction and alarm system, it is difficult for the operator to make mistakes!
Looking at 4M1E, in addition to process, Xin Tong began to pay attention to the impact of material factors.
The core material of this process is epoxy molding compound, the English name is EMC (Epoxy Molding Compound). It is made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon powder and other fillers, and a variety of Mixed with additives.
The plastic sealing process uses transfer molding to squeeze EMC into the mold cavity of the plastic sealing machine, embed the semiconductor chip in it, and simultaneously cross-link and solidify it to form a semiconductor device with a certain structural appearance.
The purpose of plastic packaging is to protect the chip from the external environment; resist external moisture, solvents, and impact; make the chip electrically insulated from the external environment; good installation performance; resist thermal shock and mechanical vibration during installation; thermal diffusion, etc. .
"How is the validity period of the plastic packaging compound controlled?" Xin Tong couldn't help asking when he saw that the homework instruction stated that the material should be awake for 24 hours and the use time after waking up is 48 hours.
"Manager Xin, we all control through the MES system! Once the plastic sealing material expires, the equipment will automatically alarm!" the process engineer said while calling up the MES system material information on the display.
"Oh!" Xin Tong nodded, and he looked up again at the sound and light alarm system attached to the device.
With such smart equipment, making products through this process is reassuring.
However, previous experience told him that there may be problems with wire punching after molding. The gold wire is too thin and too long, the injection molding process is improperly controlled, and the flow rate of molten EMC is too fast, which may impact the gold wire.
MPC5200 has 272 gold wires. Once punched, any two gold wires touch together, there is a risk of short circuit.
Obviously this is a challenge!
"How do you control the thread punching problem?" Xin Tong turned around and asked.
"Manager Xin, we need to work hard with the bonding engineers to solve this problem! The wire diameter, length and arc of the bonding wire will all affect the punching wire! Of course, the molding process parameters and EMC fluidity are also crucial!" Process Engineer explained.
"Okay, I will arrange the bonding process to make some dummies for you to debug the plastic sealing process!" Xin Tong said.
"Okay!" The process engineer nodded.
"How do you check the punching wire?" Xin Tong didn't know much about the EOL process. He had only heard about back-end molding people complaining about abnormal bonding after molding, and knew that they used an X-Ray machine.
In Mingyueguang packaging and testing factory, the front and back processes have access control, and his work card cannot open the back door. He just heard about the back process and equipment.
"Manager Xin, let's go and have a look!" Manager Han Leng said.
The inspection of punching is carried out in the X-Ray room. Because of the low radiation, this inspection process is arranged in an independent room.
Walking into the X-Ray room, it was very quiet inside, and I saw inspectors wearing red electrostatic suits performing X-Ray inspections, and gold wires were clearly visible on the color display.
"Manager Xin, this equipment is worth more than 2000 million!" Han Leng pointed at the X-Ray machine and said.
"2000 million?" Xin Tong was stunned. The semiconductor industry is really a money-burning industry.
"This equipment has a high-definition flat-panel detector with a resolution of 300W and high magnification. The structural image of the component under test is very clear, and it is easy to check the BGA bonding and welding problems after plastic packaging." Manager Han Leng said.
"Not bad!" Only with good equipment can we leave a good impression on customers. After all, customers will come to audit the factory before mass production.
After coming out of the plastic sealing process and returning to the production department, Lin Daiyu, a clerk of the production department, is distributing Guanshengyuan mooncakes to everyone.
It turns out that today is September [-]th, and tomorrow is the Lunar Mid-Autumn Festival!Xin Tong suddenly thought of his hometown in Yuezhou, his parents who lived in a dilapidated mud house, and how his mother was sitting at the entrance of the village crying when he followed Jiang Hua out to work.
When will the bright moon come? Ask the sky for wine!It’s the Mid-Autumn Festival again, and the story happens to be written during the Mid-Autumn Festival. What a coincidence.I sincerely wish everyone a happy Mid-Autumn Festival!
(End of this chapter)
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