I've done whatever I want

Chapter 141 FFL low line arc process

The chip manufacturing process is a thin layer of paper, which is called an SOP operation guide.

If you don't pierce this thin layer of paper, you will never know the secrets of the universe and you will never move forward.

But once it is punctured, when you look back, you will find it simple and ordinary, but a little bit, isn't it just some small details?But it is these inconspicuous little details that determine the final success or failure.

If it wasn't for an in-depth discussion, who would have thought that the crack problem of wafer cutting would be caused by the thinning of the first process?The choice of grinding wheel becomes a crucial factor in solving this problem.

If this reason is not found, it would be completely different to arrange the cutting process engineer to do DOE analysis every day to find the optimal parameters.

The process of solving problems is actually a process of competing with masters, and also a process of seeking help from great experts. Huashan discusses swords, and the Eight Immortals cross the sea, which is extremely enjoyable.

Fortunately, I arranged the verification of the fake film in advance. If I wait to receive the customer's wafer for verification, it is estimated that at least one wafer will be scrapped.

Wafer scrapping will seriously hit the confidence of customers, and may also cause project delays or even cancellation.

After solving a difficult problem, Xin Tong felt much more relaxed.

The bonding process is the core process of the packaging and testing factory. Although he was born in packaging and testing, Su Tianyi is in charge of the process development. He always feels at ease: "Old classmate, let's go to the bonding process!"

"Okay!" Jiang Hua nodded.

Seeing Xin Tong walk into the bonding workshop, Xiao Xianrou Zhu Tao hurried over: "Manager Xin, you are here!"

We had a drink together in the tavern last night, and we said that we would go out to start a business with Brother Xin, and now that Brother Xin is here, can he not come over to say hello?

"Zhu Gong, have you gotten used to it recently?" Xin Tong asked.

After Wu Lei resigned, Zhu Tao was introduced to the factory by him. Could Xin Tong not care?

"It's okay!" Zhu Tao replied.

Xin Tong nodded.

"Brother Xin, but I still want to learn project management with you. If you need manpower to work, remember to recruit me!" Zhu Tao said with a smile.

"Okay!" Xin Tong nodded. Recently, he also has the ambition to expand his territory. When he was a manufacturing engineer, he was followed by dozens of technicians. Now he has been promoted to be a project manager, but he has become a polished commander.

There were not many capable brothers below him, so he always felt uneasy and felt that his position as department manager was a bit empty.

In order to expand the team of the project department, Xin Tong thought about it and felt that two conditions must be met: one is to do a good job in the project in hand, so that the people above can see the results; the other is that the factory must have a steady stream of new projects come rushing over.

Without projects, the existence and expansion of the project department are meaningless.

However, in the final analysis, it is still necessary to do a good job of the project in hand. Only when the project in hand is done well can the customer have the confidence to give the factory a new project.

"I heard that the bonding process engineer Su Tianyi was having sex with the Molding process staff!" Zhu Tao suddenly lowered his voice and said.

"What happened?" Xin Tong asked curiously.

Now is the critical time for the start of the Motorola project. The customer's wafer will arrive at the factory next week. If something happens at this time, it will be a big trouble.

Fortunately, the problem occurred in the bonding process that I am proficient in, and it is within the controllable range.

"I heard that when the Molding process made fake films for the Motorola project, there was a quality problem with the punching. Both parties thought that there was a problem with the other party's process, so they couldn't come to a stalemate!" Zhu Tao said.

"Really?" Xin Tong's face was immediately covered with sorrow.

This does not mean that the war has not yet started, and there is chaos within oneself.

When he went to the X-Ray room yesterday, he was worried about this thorny quality problem. He didn't expect that the more he worried, the more things would happen. This is really under the spell of Murphy's Law.

Jiang Hua was also very puzzled, this Su Tianyi usually had a good personality, and it was not the first time that the quality problem of punching had happened, and he dealt with it patiently every time, why did he get angry this time?
Is it because this project is led by Xin Tong?
He had heard about the discord between Su Gong and Xin Tong. They used to have a competitive relationship. Now that Xin Tong has been promoted to the project manager, he still holds a grudge?
"Manager Xin, I'm worried that wire punching is related to the wire arc height. If the gold wire is too thin and too long, there will be problems if the arc height exceeds 150μm." Zhu Tao is a bonder and is very familiar with the process.

"If it exceeds 150μm, will there be problems?" Xin Tong was surprised. The bonding standard of Mingyueguang Packaging and Testing Factory is like this. The arc height of many chips exceeds 200μm, let alone 150μm.

Recalling the POD (Package Outline Drawing) given by the customer, it is indeed challenging.

The height of the plastic package of this chip is indeed lower than that of ordinary products. The height of the plastic package determines the arc height of the wire bonding. The arc height of this product should not exceed 150 μm.

The gold wire used by the customer is 0.8mil, which is also thinner than the 1mil gold wire commonly used by the factory. The influence of thermal stress on reliability must be considered in the design.

Another notable feature is that the distance between the first soldering point and the second soldering point of this chip is also slightly farther.

During plastic sealing, the thin, long and high-curvature wire arcs will definitely not be able to withstand the impact of the mold flow, resulting in Wire Sweep, and it is even inevitable that the gold wires will touch each other and cause a short circuit.

To be honest, Xin Tong has no experience in developing bonding processes for such a challenging chip.

Thinking of this, Xin Tong couldn't help feeling that Motorola's project was indeed extraordinary.

However, if this project is not challenging, customers will not find Mingyueguang packaging and testing factory to manufacture. After all, Mingyueguang's packaging and testing charges are not low.

"Manager Xin, for chip bonding like this, only ultra-low arc technology can be used!" Zhu Tao said with a smile on his face.

"Ultra-low line arc technology? Won't this cause line collapse?" Xin Tong asked rhetorically.

According to my personal experience, if the arc of the gold thread is too low, it is easy to have the problem of thread collapse.

When doing things, you can't press the gourd to float the scoop.

Zhu Tao smiled mysteriously: "I asked my former colleagues, in this case, reverse bonding or Folded Forward Loop can be used to form the wire, and the wire will not collapse."

Folded Forward Loop Folding forward arc method?This term is so fresh!

When Xin Tong heard this, he was very surprised. He had never heard of the technology mentioned by Zhu Tao. He really didn't expect that he knew a lot of things. The Yangzijiang Packaging and Testing Factory is not bad. In the office, Jiang Hua, the production supervisor, was left aside.

Jiang Hua shook his head, it's true that Xin Tong left without saying hello.

He raised his head and walked towards the QA inspection area. He missed the beautiful little swallow a little bit. He hadn't seen her for a moment, as if it had been three autumns.

"Gong Zhu, what is the Folded Forward Loop method you mentioned just now? Have you done it before?" Xin Tong asked eagerly as soon as he sat down.

"Brother Xin, Yangzijiang Packaging and Testing Factory does not have this kind of technology. I heard from my former colleague that he has now switched to Amkor."

"It turned out to be a craft developed by Amkor!"

"Yes, they are researching stacked three-dimensional packaging. This packaging has high requirements for the arc height of the chip. The traditional forward bonding method cannot meet the demand. I guess Motorola's chip needs to adopt this latest process. "

"Very good, Mr. Zhu. Ask that former colleague to see how this FFL process is implemented. I think among the factors related to wire punching, the thickness of the gold wire is specified by the customer. The first solder point and the second The distance between the solder joints is also designed by the customer, and we can only make a fuss about the arc height!" Xin Tong said.

If a technological breakthrough is made in the arc height of the gold wire, the bonding process, the most difficult bone, will be foolproof, and the Motorola project will be won just around the corner.

"Wait, let's call him together to learn about this FFL craft." After Zhu Tao finished speaking, he took out his mobile phone.

　Thank you very much Gongziwan for your big reward and monthly pass!After the typhoon Meihua is gone, the world will be cool!
　　
　
(End of this chapter)