I've done whatever I want

Chapter 142 I won’t take the blame anymore

Chapter 142 I won’t take the blame anymore

"Brother Xing, how do you like this set of FFL technology?" Zhu Tao asked excitedly after hanging up the phone.

For such a meaningful project, if this FFL process can solve the wire punching problem of the Motorola project, then Zhu Gong will have made a great contribution.

"Yes, this is black technology!" Xin Tong gave a thumbs up.

In his opinion, FFL is like the eighteen palms of the Beggar Gang, the pinnacle of the beggar gang, with infinite power. With this set of skills, Xin Tong feels that winning the Motorola project is a certainty.

"Brother Xin, it is generally believed that those who do technology must rely on their own real skills to make a living. I think contacts and resources are also very important!" Zhu Tao said with a smile.

As far as bonding technology is concerned, Zhu Tao thinks that his level is average, but he has a wide network of contacts and a lot of resources in his hands. Among his friends, there are many experts in the bonding process. These people are proficient in ASM and KNS bonding equipment technology.

Whenever you encounter a problem, just make a phone call to ask them for advice, and they will definitely give a warm reply in the first time.

"Zhu Gong, you're quite right." Xin Tong nodded, manufacturing crafts requires brave exploration and accumulation of experience. It is very important to borrow other people's successful experience.

Take the Motorola project as an example. The factory's previous experience was in packaging chips for the consumer electronics market. This MPC5200 is different. It is a chip for the automotive market.

Of course, the production difficulty of chips in the automotive market is much higher than that of chips in the consumer market, and those with relevant experience must avoid detours.

But building up connections and getting people to help you is even more difficult than reaching the sky!
When there is no conflict of interest, people are willing to lend a helping hand, but once there is a conflict of interest, external resources such as nobles are very fragile, and you need to be hardworking yourself!

Regarding FFL technology, although Amkor's bonding masters talked about it on the phone, the most convincing thing is practice, and practice is the only criterion for testing the truth.

Thinking of this, Xin Tong patted Xiao Xianrou on the shoulder: "Gong Zhu, if you have time, find a bonding machine and try the FFL process!"

Generally speaking, the development of new processes is the work of process engineers, but if you want to ask Su Tian to try this set of processes, if the process verification is not yet mature, if you ask him to do it, you will definitely resist.

If the experiment fails, he must laugh at what a bad idea it is?

Xin Tong also thought about asking Zhu Tao to try. In case of any problems in the FFL verification process, he can call his old colleagues for advice. Besides, even if he fails, there will not be so many gossips.

"Brother Xing, I'll show you a sample before leaving get off work!" Zhu Tao said confidently.

"Very good!" Xin Tong patted Zhu Tao's shoulder and nodded. At the critical moment, this little fresh meat is still reliable.

The last time I played basketball with a foreigner, it was he who stood up and helped me a lot.

Without his support, it would not be easy to win over a foreigner who is skilled and tall.

After arranging the bonding process verification, Xin Tong turned and walked towards his office.

Not long after he left the office of the engineering department, the Review Meeting on bond punching was held.

"Xiao Gang, please talk about the problem first." Ball bonding king Sun Xiaolong presided over the meeting.

Xiaogang is a process engineer in the Molding process.

"Gong Sun, Manager Xin visited our Molding process yesterday, and arranged for you to use fake chips to bond wires, make some chips for us to make plastic packaging, and verify the bonding and plastic packaging processes. We then arranged for engineering verification production. In the morning When scanning the X-ray, it was found that every chip had wire punching problems, and the defective rate was 100%." ​​Xiaogang said while giving Su Tianyi a sharp look.

If the bonding process is done well, how come so many defects are produced?
The last time there was a problem of 100% poor punching can be traced back to the day when Pangu opened the sky.

"What do you mean?" Why do you have to act like an enemy when discussing a problem?Su Tianyi rolled his eyes at Xiaogang.

"Calm down, generally speaking, the problem of wire punching has a lot to do with bonding. Su Gong, can our current bonding process be optimized?" Sun Xiaolong asked.

It’s understandable that Xiaogang hates him. When such a problem happened before, the bonding process parameters had to be changed, or the wiring path was checked to see if it was correct, or the hot plate was checked to check whether the second solder joint was pressed normally. Wait, it can be avoided anyway.

Su Tianyi shook his head and said decisively: "Boss, this product is quite special and it can't be done!"

"Why?" Sun Xiaolong asked in surprise.

"Gong Sun, most of the wire punching problems are related to the Loop arc height problem. This time the arc height problem is different. I have seen the POD of this chip. The arc height cannot be made too high. The most it can do is To 150μm." Su Tianyi said.

"150μm?" Sun Xiaolong asked.

This arc height is indeed the ultimate in craftsmanship at present.

"I have carefully calculated that the thickness of this chip plastic package is 425μm, of which the grain thickness is 150μm, the depth of laser printing is 50μm, and a margin of 100μm must be reserved for gold wire arcs, otherwise there is a risk of wire leakage. After calculating this, the space left for arc height is only 125μm." Su Tianyi said.

"The 125μm process is extremely difficult!" Sun Xiaolong said.

"However, we can make the arc height to 150μm. In this way, there is still a margin of 75μm between the line arc and the exposed wire material, which basically meets the design needs. I did not expect that 150% wire punching problems will occur at 100μm. If it is lowered, it will Tasi appeared." Su Tianyi said.

A 0.8mil gold wire has been tested before, and the risk of tumbling is very high if it is lower than 150μm.

The pursuit of automotive-grade products is zero defects. It is definitely not acceptable to make products for Motorola without the risk of wire collapse.

"Is there no other way to bond?" Sun Xiaolong asked.

"Old Sun, there is really no other way, unless the arc height is changed to 100μm, but our current process simply cannot achieve it!" Su Tian looked embarrassed and cursed secretly in his heart. I really don't understand, this can't be done. The project was also taken over. How did Luo Gaogong do the technical evaluation?Is your brain flooded?
"Xiao Gang, Mr. Su has made his words very clear. It's not that Bond doesn't want to help, but Bond really has nothing to do!" Sun Xiaolong said.

"Gong Sun, do you mean to let us Molding adjust the process? Unless we change the mold and change the direction of the runner, we will be even more helpless!" Xiaogang sighed.

"Wait, I'll report such an important matter to Gaogong Luo!" Sun Xiaolong said, and dialed Logitech.

After a while, Logitech came to the conference room.

"Do you want to change the mold runner? Don't even think about it! Dr. Li has been paying attention to this project, and now it is on the verge of completion, and we don't have time to change the mold!" Luo Gaogong knew very well that it would take at least one month to change the precision mold , and there is no guarantee of one-time success.

If you wait another month, the customer will definitely lose his patience, and Dr. Li will definitely lose his patience too.

"Luo Gaogong, I can't do this!" Su Tian glanced at Logitech. What did you do when you were doing the feasibility analysis of the project?Why not consult me?Let me take the blame now, I will definitely not do it.

"Motorola's chip can be made by other factories, why can't Mingyueguang do it? Su Gong, this hard bone, you have to chew it off no matter what!" Luo Gaogong issued an administrative order.

Su Tianyi lowered his head and said nothing.

No one expected that after the meeting, he actually submitted a resignation report to Sun Xiaolong.

He has shown his cards, and he will no longer take the blame!

 Su Tian's life hangs on a thread!It feels bad to be the scapegoat!
  
 
(End of this chapter)

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